ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
From inside the book
Results 1-3 of 83
Page 318
Directorate-General for Telecommunications, Information Industries, and
Innovation. 20 l; 10 o 4. 8 cm 12 Figure 4. Mises invariant along the vertical side
of the crystal for the six stages of growth. We have found in the previous sections
that the ...
Directorate-General for Telecommunications, Information Industries, and
Innovation. 20 l; 10 o 4. 8 cm 12 Figure 4. Mises invariant along the vertical side
of the crystal for the six stages of growth. We have found in the previous sections
that the ...
Page 321
Directorate-General for Telecommunications, Information Industries, and
Innovation. The vertical dotted line in figure 10 indicates the instant when the
material around the first thermocouple is solidified. However, measurements
show at that ...
Directorate-General for Telecommunications, Information Industries, and
Innovation. The vertical dotted line in figure 10 indicates the instant when the
material around the first thermocouple is solidified. However, measurements
show at that ...
Page 322
Directorate-General for Telecommunications, Information Industries, and
Innovation. We have indicated in figure 10 the calculated values corresponding
to the location of the first thermocouple. One observes that the theoretical values
are ...
Directorate-General for Telecommunications, Information Industries, and
Innovation. We have indicated in figure 10 the calculated values corresponding
to the location of the first thermocouple. One observes that the theoretical values
are ...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
Technology Transfer from Research to Development Project 97 Pype P Van Meerbergen J De Man | 5 |
Materials and Devices Toward ThreeDimensional Integration Project 245 Cahill C G Dunne B OFlanagan S Hobbs L Mathewson A | 21 |
Physical ºquivalentCircuit Models for GaAs Mesſets Project 255 Ghione G Naldi C Pettenpaul E Ponse F | 52 |
Copyright | |
50 other sections not shown
Other editions - View all
Common terms and phrases
abstract abstract machine algorithm allows analysis Aphrodite application approach architecture Artificial Intelligence basic behaviour BFNEW BICMOS cell chip circuit CMOS complex components Computer concepts constraints DAIDA database defined definition described devices distributed domain dynamic environment error Esprit Project etch evaluation example execution expert systems Figure function GaAs gate global goal graphical GRASPIN IEEE implementation information system input integrated interaction interpreter knowledge base knowledge representation language layer LFSR logic programming machine mapping MESFET metaclass method methodology migration module node object-oriented objects operations output parallel parameters partial evaluation PCTE performance phase PIMS possible predicates problem procedure processor programming language project management Prolog Prolog III prototype query representation requirements rules semantic signal simulation specification structure subcircuit task techniques transistor transputer UNIX user interface VLSI wafer