ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
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Page 130
... etching contact holes in SiO ,, stage one uses a high etch rate but low selectivity to Si , while stage two requires high selectivity to silicon but may have a lower etch rate . The need to use a multi - step etch process 130.
... etching contact holes in SiO ,, stage one uses a high etch rate but low selectivity to Si , while stage two requires high selectivity to silicon but may have a lower etch rate . The need to use a multi - step etch process 130.
Page 133
... etch rate is not the sole consideration and other variables , especially photoresist selectivity , across - the - wafer uniformity , and particle generation , are found to respond to changes in RF power and the electrode gap . Thus care ...
... etch rate is not the sole consideration and other variables , especially photoresist selectivity , across - the - wafer uniformity , and particle generation , are found to respond to changes in RF power and the electrode gap . Thus care ...
Page 137
... etching per- formance will be presented . In the case of silicon etching with pure SF6 , emission spectroscopy and quadrupole mass spectrometry have been applied to reveal densities of neutral particles and ions in the etch plasma under ...
... etching per- formance will be presented . In the case of silicon etching with pure SF6 , emission spectroscopy and quadrupole mass spectrometry have been applied to reveal densities of neutral particles and ions in the etch plasma under ...
Contents
A Technology Transfer from Research to Development Project | 3 |
BitRate Reduction of High Quality Audio Signals Using FloatingPoint | 13 |
Materials and Devices Toward ThreeDimensional Integration Project 245 | 22 |
Copyright | |
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Common terms and phrases
abstract algorithm allows analysis Aphrodite application approach architecture array basic behaviour BICMOS cell chip circuit CMOS communication complex components Computer concepts constraints database debugging defined demonstrator described devices distributed domain dynamic efficient environment error Esprit Project etching evaluation example execution expert systems Figure function GaAs gate GEODE global goal graphical IEEE implementation inference engine input integrated integrated circuits interaction interpreter kernel knowledge base knowledge representation layer LFSR logic programming machine mechanism memory MESFET method methodology module node object-oriented objects operations optimization output parallel parameters partial evaluation PCTE performance phase possible predicates problem Proc procedure processor Prolog Prolog III prototype query relations representation requirements rule semantic sequence signal simulation specific structure subcircuit SUPERNODE task techniques transistor transputer tuple UNIX VLSI wafer