ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
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Page 233
... material . To avoid consequent damage , it is usual to surround the hole with a pad of copper which must be large enough to withstand these forces , and has been empirically derived to be 1.5 times the hole size . In addition there are ...
... material . To avoid consequent damage , it is usual to surround the hole with a pad of copper which must be large enough to withstand these forces , and has been empirically derived to be 1.5 times the hole size . In addition there are ...
Page 310
... material clearly exhibits the presence of arsenic + impurity precipitates only pinned on dislocations whereas material prepared with the high temperature process shows also both kinds of precipitates but with strong nonuniformities also ...
... material clearly exhibits the presence of arsenic + impurity precipitates only pinned on dislocations whereas material prepared with the high temperature process shows also both kinds of precipitates but with strong nonuniformities also ...
Page 312
... material has been achieved using both In- alloyed and undoped GaAs grown with an improved process . Moreover improved undoped material is definitely better than In - alloyed one and this result can be considered as a breakthrough in ...
... material has been achieved using both In- alloyed and undoped GaAs grown with an improved process . Moreover improved undoped material is definitely better than In - alloyed one and this result can be considered as a breakthrough in ...
Contents
A Technology Transfer from Research to Development Project | 3 |
BitRate Reduction of High Quality Audio Signals Using FloatingPoint | 13 |
Materials and Devices Toward ThreeDimensional Integration Project 245 | 22 |
Copyright | |
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Common terms and phrases
abstract algorithm allows analysis Aphrodite application approach architecture array basic behaviour BICMOS cell chip circuit CMOS communication complex components Computer concepts constraints database debugging defined demonstrator described devices distributed domain dynamic efficient environment error Esprit Project etching evaluation example execution expert systems Figure function GaAs gate GEODE global goal graphical IEEE implementation inference engine input integrated integrated circuits interaction interpreter kernel knowledge base knowledge representation layer LFSR logic programming machine mechanism memory MESFET method methodology module node object-oriented objects operations optimization output parallel parameters partial evaluation PCTE performance phase possible predicates problem Proc procedure processor Prolog Prolog III prototype query relations representation requirements rule semantic sequence signal simulation specific structure subcircuit SUPERNODE task techniques transistor transputer tuple UNIX VLSI wafer