ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
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Page 61
... substrate . In the second type of substrate Cr was added in a concetration of approximately 2 ∙ 1016 cm - 3 ; this is called " med . Cr - doped " semi - insulated substrate . For the fabrication of FETs the standard SIEMENS selective ...
... substrate . In the second type of substrate Cr was added in a concetration of approximately 2 ∙ 1016 cm - 3 ; this is called " med . Cr - doped " semi - insulated substrate . For the fabrication of FETs the standard SIEMENS selective ...
Page 234
... substrate is clearly illustrated in figure 12 . As laser drilling of holes is a contactless process , high precision X - Y tables can be used for high placement accuracy ( controllable to + 2 um ) and no pads are required outside the ...
... substrate is clearly illustrated in figure 12 . As laser drilling of holes is a contactless process , high precision X - Y tables can be used for high placement accuracy ( controllable to + 2 um ) and no pads are required outside the ...
Page 303
... substrate and the active layer respectively . The percentage of DENSE ROW with low threshold voltage standard deviation ( GVth < 15mV ) in undoped dislocated GaAs substrates has been demonstrated to be equal or even better ( at GVth ...
... substrate and the active layer respectively . The percentage of DENSE ROW with low threshold voltage standard deviation ( GVth < 15mV ) in undoped dislocated GaAs substrates has been demonstrated to be equal or even better ( at GVth ...
Contents
A Technology Transfer from Research to Development Project | 3 |
BitRate Reduction of High Quality Audio Signals Using FloatingPoint | 13 |
Materials and Devices Toward ThreeDimensional Integration Project 245 | 22 |
Copyright | |
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Common terms and phrases
abstract algorithm allows analysis Aphrodite application approach architecture array basic behaviour BICMOS cell chip circuit CMOS communication complex components Computer concepts constraints database debugging defined demonstrator described devices distributed domain dynamic efficient environment error Esprit Project etching evaluation example execution expert systems Figure function GaAs gate GEODE global goal graphical IEEE implementation inference engine input integrated integrated circuits interaction interpreter kernel knowledge base knowledge representation layer LFSR logic programming machine mechanism memory MESFET method methodology module node object-oriented objects operations optimization output parallel parameters partial evaluation PCTE performance phase possible predicates problem Proc procedure processor Prolog Prolog III prototype query relations representation requirements rule semantic sequence signal simulation specific structure subcircuit SUPERNODE task techniques transistor transputer tuple UNIX VLSI wafer