ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
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Page 128
2.2 200mm Single Wafer Etching As wafer sizes increase and the value of each
wafer increases accordingly, equipment manufacture has shifted away from
batch type reactors towards single wafer etch (SWE) machines [3]. Each chamber
of ...
2.2 200mm Single Wafer Etching As wafer sizes increase and the value of each
wafer increases accordingly, equipment manufacture has shifted away from
batch type reactors towards single wafer etch (SWE) machines [3]. Each chamber
of ...
Page 129
First results show that for the aluminium etch process in the MPE 3003 a
throughput of 20-50 wafers per hour can be ... an allowance for a stop in the
transfer chamber while the robotic arm is scanned by a wafer breakage detection
device [5].
First results show that for the aluminium etch process in the MPE 3003 a
throughput of 20-50 wafers per hour can be ... an allowance for a stop in the
transfer chamber while the robotic arm is scanned by a wafer breakage detection
device [5].
Page 165
Package The wafer will be attached with an epoxy glue into an AlN substrate with
2 levels interconnection for power and ground and one level for signals. Because
of problems with delivery of 5" AlN substrates, for the first demonstrator, the 4.5 ...
Package The wafer will be attached with an epoxy glue into an AlN substrate with
2 levels interconnection for power and ground and one level for signals. Because
of problems with delivery of 5" AlN substrates, for the first demonstrator, the 4.5 ...
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Contents
Technology Transfer from Research to Development Project 97 Pype P Van Meerbergen J De Man | 5 |
Materials and Devices Toward ThreeDimensional Integration Project 245 Cahill C G Dunne B OFlanagan S Hobbs L Mathewson A | 21 |
Physical ºquivalentCircuit Models for GaAs Mesſets Project 255 Ghione G Naldi C Pettenpaul E Ponse F | 52 |
Copyright | |
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Common terms and phrases
abstract abstract machine algorithm allows analysis Aphrodite application approach architecture Artificial Intelligence basic behaviour BFNEW BICMOS cell chip circuit CMOS complex components Computer concepts constraints DAIDA database defined definition described devices distributed domain dynamic environment error Esprit Project etch evaluation example execution expert systems Figure function GaAs gate global goal graphical GRASPIN IEEE implementation information system input integrated interaction interpreter knowledge base knowledge representation language layer LFSR logic programming machine mapping MESFET metaclass method methodology migration module node object-oriented objects operations output parallel parameters partial evaluation PCTE performance phase PIMS possible predicates problem procedure processor programming language project management Prolog Prolog III prototype query representation requirements rules semantic signal simulation specification structure subcircuit task techniques transistor transputer UNIX user interface VLSI wafer