ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1North-Holland, 1988 - 1759 pages Part1. Advanced microelectronics. VLSI technologies - comparisons and prospects. Software technology. Advanced information processing. Part2. Office systems.Computer integrated manufacturing. Information exchange system. |
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Page 128
2.2 200mm Single Wafer Etching As wafer sizes increase and the value of each
wafer increases accordingly , equipment manufacture has shifted away from
batch type reactors towards single wafer etch ( SWE ) machines ( 3 ) . Each
chamber ...
2.2 200mm Single Wafer Etching As wafer sizes increase and the value of each
wafer increases accordingly , equipment manufacture has shifted away from
batch type reactors towards single wafer etch ( SWE ) machines ( 3 ) . Each
chamber ...
Page 129
First results show that for the aluminium etch process in the MPE 3003 a
throughput of 20-50 wafers per hour can be ... an allowance for a stop in the
transfer chamber while the robotic arm is scanned by a wafer breakage detection
device ( 5 ) ...
First results show that for the aluminium etch process in the MPE 3003 a
throughput of 20-50 wafers per hour can be ... an allowance for a stop in the
transfer chamber while the robotic arm is scanned by a wafer breakage detection
device ( 5 ) ...
Page 165
Package The wafer will be attached with an epoxy glue into an AIN substrate with
2 levels interconnection for power and ground and one level for signals .
Because of problems with delivery of 5 " AIN substrates , for the first demonstrator
, the ...
Package The wafer will be attached with an epoxy glue into an AIN substrate with
2 levels interconnection for power and ground and one level for signals .
Because of problems with delivery of 5 " AIN substrates , for the first demonstrator
, the ...
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Contents
A Technology Transfer from Research to Development Project | 3 |
BitRate Reduction of High Quality Audio Signals Using FloatingPoint | 13 |
Materials and Devices Toward ThreeDimensional Integration Project 245 | 22 |
Copyright | |
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Common terms and phrases
achieved active algorithm allows analysis application approach architecture basic block called cell chip circuit CMOS combination communication complex components concepts connected considered consists constraints contains defined definition demonstrator described devices direction distributed efficient environment error ESPRIT etch evaluation example execution Figure function gate given goal implementation important input integrated interface interpreter knowledge language layer logic machine material means measurements memory metal method module node objects obtained operator output parallel pattern PCTE performance phase possible presented problem processor prototype reference representation represented requirements rules selected sequence shown shows signal simulation single specification step structure task techniques theory transistor verification wafer
Bibliographic information
| Title | ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Part 1 Volume 5 of ESPRIT : annual conference : proceedings ESPRIT '88: Putting the Technology to Use : Proceedings of the 5th Annual ESPRIT Conference, Brussels, November 14-17, 1988, Commission of the European Communities. Directorate-General for Telecommunications, Information Industries, and Innovation Volume 11852 of EUR (Brussels), ISSN 0303-755X Volume 11852 of EUR (Series) Publication no. EUR 11852 of the Commission of the European Communities, Directorate-General Telecommunications, Information Industries, and Innovation, Luxembourg |
| Author | Commission of the European Communities. Directorate-General for Telecommunications, Information Industries, and Innovation |
| Publisher | North-Holland, 1988 |
| Original from | the University of California |
| Digitized | 6 Nov 2009 |
| ISBN | 0444871454, 9780444871459 |
| Length | 1759 pages |
| Export Citation | BiBTeX EndNote RefMan |